Filling and cleaning are done in only one single chamber-Through Holes and Blind Holes on both sides in one step
Plugging Machines for Through and Blind Holes THP 32 and THP 35 Series
Fill Blind Vias and Through Holes in one step. No change of Filing Head needed.
Plugging Machines for Through Holes THP 10 Series
Our THP 10 can fill panel with very high Aspect Ratio up to 40:1
Many times sold and good in price.
Files through holes with conductive or non-conductive Paste.
The PD 50 removes epoxy and copper burrs from PCB’s and innerlayers.
The PD 30 removes epoxy and copper burrs from PCB’s and innerlayers.
Designed for plugging paste recovery on ITC Hole Plugging Machines.
The Power Squeegee – PS200 is designed for via hole fill on high Aspect Ratio boards. This hand tool is especially for prototype boards with limited plugging areas like BGA’s or similar and process evaluation.
Designed for grinding the Squeegee rubbers of ITC Hole Filling Machines.
Designed for cleaning the filling Heads of ITC Hole Plugging Machines.