Soldermask Spray Coating System USC 3000 ®

High Speed – Spray – Coater For coating with photo imageable solder mask. Low Pressure High Volume (LPHV) system – No electrostatic.

Main advantages for solder mask spray coating

  • Fully automatic line for high throughput
  • Double side process in one step
  • Shorter developing time to the open holes
  • Different coating thickness on both sides possible
  • Fast change of panel sizes and type
  • Small footprint
  • Interchangeable ink for different coating